Laser Equipment - Precision Processing, Innovative Technology

🔍

Measurement range covers from mΩ to MΩ

Non-contact machining without issues of knife change, fracture and abrasion

Comprehensive automation design applicable to both large-batch and small-batch production.

Under-fill removing is done directly without cleaning surface of object, simplifying production.

Applicable to all kinds of ceramic material processing.

Dual-head laser design that improves capacity.

Dual-head laser design that improves capacity.

Spatter-free after marking

Capable of 1D/2D barcode or any laser marking

TSV (Through-Silicon Via) serves as a critical connection channel in 3D stacking technology