Semiconductor Industry -

Laser Marker/Lead frame Laser Marking

Compatible with various metal lead frame materials for laser engraving

TSV Si Wafer Drilling

TSV (Through-Silicon Via) serves as a critical connection channel in 3D stacking technology

Wafer Laser Grooving

Single-head laser barcode marking machine

Capable of 1D/2D barcode or any laser marking

Laser Marking

Dual-head laser design that improves capacity.

Used in mass production lines, ensuring consistent cleaning, yield rate, and production cycle stability with high-precision cleaning that does not damage the substrate.