LASER Equipment -

雷科股份有限公司

Laser Equipment - Precision Processing, Innovative Technology

Laser Equipment - Precision Processing, Innovative Technology
  • Passive Component Industry
    Passive Componen..
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor In..
  • Optoelectronics Industry
    Optoelectronics ..

LASER Equipment

Panel Laser Marking Machine

Depending on materials, several laser types may be chosen from

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FR4 substrate trimmer

Innovative specialized cutting technique with minimal carbonization on surface

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Under-fill Laser removing machine

Reducing the loss on yield and work hours by manual operation

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Stencil laser cutting

Equipped with highly stable German fiber laser and exhibiting stable utilization

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Automatic under-fill removing machine

Non-contact machining without issues of knife change, fracture and abrasion

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Semi-automatic under-fill removing machine

Under-fill removing is done directly without cleaning surface of object, simplifying production procedures

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ABF Composite Material Precision Cutting Laser Cutting Machine

High precision, strong flexibility, stable processing quality, customized design and automated connection

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Laser Marker/Lead frame Laser Marking

Compatible with various metal lead frame materials for laser engraving

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TSV Si Wafer Drilling

TSV (Through-Silicon Via) serves as a critical connection channel in 3D stacking technology

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Single-head laser barcode marking machine

Capable of 1D/2D barcode or any laser marking

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