What is TSV Laser Drilling?

TSV (Through Silicon Via) is a key technology for 3D IC packaging, using lasers to drill microvias in silicon wafers for vertical interconnection after metal filling.

What are the processing advantages?

Compared to traditional etching, laser drilling is faster, maskless, and capable of high aspect ratio deep hole processing.

Semiconductor Industry TSV Si Wafer Drilling

TSV Si Wafer Drilling

Semiconductor Industry

Passive Componen..
PCB/FPC Industry
Semiconductor In..
Optoelectronics ..

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TSV Si Wafer Drilling

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Passive Componen..
PCB/FPC Industry
Semiconductor In..
Optoelectronics ..

TSV Si Wafer Drilling

Semiconductor Industry

TSV Si Wafer Drilling

With the rapid explosion of AI development in Taiwan, TSV (Through-Silicon Via) serves as a critical connection channel. TSV 3D stacking technology involves wafer drilling, filling conductor vias, and wafer bonding to stack and connect all chip layers.
Laser Tek TSV Drilling Machine utilizes Femtosecond Laser
Achieves chip-free edges, no cracks, and no subsurface damage for both front and back holes
Front/Back hole diameter error < 5μm

Product Description

Other Product Description

Through-hole Quality

Polished Surface (Top Side)

Front/Back hole diameter error < 5μm<br>(Top View)

Front/Back hole diameter error < 5μm<br>(Bottom View)

Blind Hole Quality