Vantage 2

• Laser non-contact measurement applicable to both dry and wet products.
• Multi-points automatic measurement available with analysis result.
• 2D/3D non-contact profiling system [Measuring]2D (y,z or x,z), 3D (x,y,z), Height, Height (Avg), Length, Angle, Angle (Planar), Center, Roughness, Rz).

• 【Applicable Range】 Semiconductor industry packaging and testing, optoelectronic industry, PCBs fabrication, SMT industry, hybrid circuits, passive components.

• 【Application】 Thickness measurement of thick film printing, hybrid circuits, SMT solder paste, uBGA, TAB, CSP, Flip/Chip, 8 Wafer Warpage.