詢問
表單
量測SEMI/PCB - 精準檢測,品質管控
SEMI/PCB Measurement - Precision Inspection, Quality Control
CT 600ST
cyber非接觸式掃描儀
CT 600ST
- Dual Non-Contact Measurement System For Large Parts.
- 3d mapping of thickness,bow, warpage and rouhgness。
- User friendly concept。
- Sophisticated analysis and automation software。
- 【適用範圍】 Typical applications for the CT 600ST are the analysis and quality control of large parts, such as large wafers, PCBs, substrates, glas and other optical components.<br> Thickness, geometry and position measurement of highly contoured objects like lenses, gaskets, turbine blades, as well as flatness and coplanarity analysis are other popular applications.
- 【產品用途】 Total thickness variation (TTV)、Flatness, warpage and bow、Printed products, systems or devices、Panel level packaging devices、Fuel cell elements、Medical devices.
產品說明
詳細產品內容或加工說明
CT 600ST
Dual Non-Contact Measurement System For Large Parts
Thickness of a Fuel Cell Component
Wafer Thickness Map(TTV)t
Front-and Backside Metallization of a Solar Cell
德國 Cyber Technologies 非接觸式掃描儀



