FLATNESS MEASUREMENT

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雷科股份有限公司

量測SEMI/PCB - 精準檢測，品質管控

SEMI/PCB Measurement - Precision Inspection, Quality Control
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FLATNESS MEASUREMENT

cyber非接觸式掃描儀

FLATNESS MEASUREMENT
FLATNESS MEASUREMENT

  • Flatness measurement is required for a lot of components including wafers, optical and mechanical parts. Using our non-contact 3D measurement technology, accurate flatness measurement can be achieved over large areas.
  • 【產品用途】 ct-300、ct-600s、ct-350s

產品說明

詳細產品內容或加工說明

FLATNESS MEASUREMENT FLATNESS MEASUREMENT
  • Measuring the flatness of electronic components and wafers
ELECTRONIC COMPONENT ELECTRONIC COMPONENT
  • Countour map of an electronic component
  • Advanced etch removing and modifiying algorithms
  • Use polygon shape cursors to mark region of interest
HARD DISK DEVICE HARD DISK DEVICE
  • Contour map of hard disk device
  • Effective filters to separate flatness from surface roughness
  • Measuring the flatness relative to reference areas
SURFACE OF A WAFER SURFACE OF A WAFER
  • Surface of a wafer
  • Accurate flatness measurement over large areas
  • Colors can be set to specification limits
DIE TILT– LEADFRAME DIE TILT– LEADFRAME
  • 3D Image die tilt
  • Measures Die Tilt, BLT height and Position
  • Rotation and offset relative to cavity center
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