Why is laser probe cleaning equipment needed?

Traditional cleaning methods may damage probes or be incomplete. Laser cleaning non-destructively removes contamination, extends probe card life, and ensures yield and stability in semiconductor testing.

Will laser cleaning damage the probe substrate?

No. The equipment uses advanced optical systems and custom spot optimization to precisely control energy, providing high-precision cleaning without damaging the substrate.

Does this equipment support automated production?

Yes. It features fully automated Tray loading/unloading, positioning cameras, AI contamination detection, and MES integration capability, designed specifically for long-term mass production.

Semiconductor Industry

Laser Equipment - Precision Processing, Innovative Technology

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Passive Componen..
PCB/FPC Industry
Semiconductor In..
Optoelectronics ..

Semiconductor Industry

Purpose of Use
Designed for mass production lines, ensuring consistent cleaning, yield rate, and production cycle stability with high-precision cleaning that does not damage the substrate.
Primary Objective
To execute mass production, increase yield rates, reduce cleaning time, and stabilize manufacturing processes.
Laser Module
Equipped with a high-stability laser source, supporting customized energy curves and higher pulse repetition rates.
Optical System
Advanced lens combined with custom spot optimization, tailored for client-specific probe density and angle adjustments.
Fixture Design
Custom precision fixtures (including angle compensation and high-precision X/Y/Z adjustments).
Processing Speed
Employs the industry's fastest line-scanning method to effectively increase processing speed.
Software Features
Comprehensive interface including recipe management, coordinate recording, historical tracking, and MES integration.
Automation Capability
Supports full automation: Tray loading/unloading, positioning cameras, and AI-driven contamination detection.
Reliability
Engineered for long-term mass production.

Product Description

Other Product Description

Before Processing - Central Area Probe (High Magnification Microscope)

After Processing - Central Area Probe Cleaning Excellent. Substrate Undamaged

Before Processing - Lower Right Area Probe (High Magnification Microscope)

After Processing - Lower Right Area Probe Cleaning Excellent. Substrate Undamaged

Before Processing - Right Side Area Probe (High Magnification Microscope)

After Processing - Right Side Area Probe Cleaning Excellent. Substrate Undamaged