Under-fill Laser removing machine

PCB/FPC Industry

雷科股份有限公司

Laser Equipment - Precision Processing, Innovative Technology

Laser Equipment - Precision Processing, Innovative Technology
  • Passive Component Industry
    Passive Componen..
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor In..
  • Optoelectronics Industry
    Optoelectronics ..

Under-fill Laser removing machine

PCB/FPC Industry

Under-fill Laser removing machine
Under-fill Laser removing machine

  • Reducing the loss on yield and work hours by manual operation.
  • Simple graphical user interface that is easy to use.
  • Mounted height measuring sensor provides flatness for underfill removal.
  • Realizing multiple times of process and height-measured underfill removing.
  • 【Laser Type】 CO2 laser
  • 【Application】 Laser underfill removing machine for BGA rework underfill

Product Description

Other Product Description

HDI underfill removing HDI underfill removing
HDI underfill removing HDI underfill removing
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