Inquiry
Cart
Laser Equipment - Precision Processing, Innovative Technology
Laser Equipment - Precision Processing, Innovative Technology
Laser Dry Etching Direct Forming Machine / Laser Direct Forming Machine LDS
PCB/FPC Industry
Laser Dry Etching Direct Forming Machine / Laser Direct Forming Machine LDS
- Equipped with Femtosecond Laser and Cold Ablation Technology, ensuring no damage to materials.
- Utilizes femtosecond characteristics: short pulse width and low thermal effect to rapidly ablate material, minimizing carbonization and heat diffusion.
- Suitable for various materials including PI Film, Cover Layer, FR4, FPC, PTFE, Ceramic, and LTCC.
- Obtain patterning results within 10 minutes—the optimal choice for efficient electrical testing.
Product Description
Other Product Description
