Single Head Laser Drilling

Passive Component Industry

雷科股份有限公司

Laser Equipment - Precision Processing, Innovative Technology

Laser Equipment - Precision Processing, Innovative Technology

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  • Passive Component Industry
    Passive Componen..
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor In..
  • Optoelectronics Industry
    Optoelectronics ..

Single Head Laser Drilling

Passive Component Industry

Single Head Laser Drilling
Single Head Laser Drilling

LR-500

  • Scribing, drilling, and cutting all in one.
  • Drilling speed : 10 hole/sec (Hole Diameter=50um).
  • Appropriate to use for thin film.
  • 【Laser Type】 Customized design for: SMT, FPC, PCB, and Photoelectric industry.
  • 【Application】 LR-500

Product Description

Other Product Description

Drilling diameter (front) 100μm aperture. Drilling diameter (front) 100μm aperture.
Drilling diameter (back) 100μm aperture. Drilling diameter (back) 100μm aperture.
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