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SEMI/PCB Measurement - Precision Inspection, Quality Control
SEMI/PCB Measurement - Precision Inspection, Quality Control
Dry Furnace
Temperature Monitor/SMD/BGA/Drying Oven/PTF/High Temp Oven
Dry Furnace
DRYING FURNACE FOR PASTE PRINTING
- Thick film drying process.
- Temperature controller(S type)–Single-loops smart P.I.D temperature controller with fast and highly efficient heat compensation.
- Each heater is paired with dual overheat protection system.
- Depending on different characteristics of printing paste, a suitable heater may be chosen in the design.
- Common temperature standard model: 200ºC(max.), or higher temperature upon request.
- 【Application】 FPC and PCB industries.
Product Description
Other Product Description
Dry Furnace
Technical specification
Detailed related technical specifications.
| Model | DRY Series (DRY-24 / DRY-32) |
|---|---|
| Max Temperature | 200°C (Customizable) |
| Heating System | Infrared (Short / Medium / Long Wavelength) |
| Insulation | Ceramic Fiber (Asbestos-free) |
| Application | Thick Film Drying, Paste Curing, Solvent Removal |
| Features | Excellent Exhaust System, Chamber Lift Open/Non-lift |