CT 600ST

cyber非接觸式掃描儀

雷科股份有限公司

量測SEMI/PCB - 精準檢測,品質管控

SEMI/PCB Measurement - Precision Inspection, Quality Control
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CT 600ST

cyber非接觸式掃描儀

CT 600ST
CT 600ST

  • Dual Non-Contact Measurement System For Large Parts.
  • 3d mapping of thickness,bow, warpage and rouhgness。
  • User friendly concept。
  • Sophisticated analysis and automation software。
  • 【適用範圍】 Typical applications for the CT 600ST are the analysis and quality control of large parts, such as large wafers, PCBs, substrates, glas and other optical components.<br> Thickness, geometry and position measurement of highly contoured objects like lenses, gaskets, turbine blades, as well as flatness and coplanarity analysis are other popular applications.
  • 【產品用途】 Total thickness variation (TTV)、Flatness, warpage and bow、Printed products, systems or devices、Panel level packaging devices、Fuel cell elements、Medical devices.

產品說明

詳細產品內容或加工說明

CT 600ST CT 600ST
Dual Non-Contact Measurement System For Large Parts Dual Non-Contact Measurement System For Large Parts
Thickness of a Fuel Cell Component Thickness of a Fuel Cell Component
Wafer Thickness Map(TTV)t Wafer Thickness Map(TTV)t
Front-and Backside Metallization of a Solar Cell Front-and Backside Metallization of a Solar Cell
德國 Cyber Technologies 非接觸式掃描儀 德國 Cyber Technologies 非接觸式掃描儀
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