What does the "T" stand for in the model name?

"T" stands for "Twin" (dual sensors) or "Thickness", indicating the system is equipped with opposing top and bottom sensors to simultaneously scan both surfaces for high-precision absolute thickness and TTV measurements.

What are the key features of CT 350T/250T?

The core feature is "Double-Sided Metrology", allowing for absolute thickness, Bow/Warp, and TTV data acquisition without flipping the sample. It supports automation and various sensors (e.g., Chromatic Confocal, Interferometer) for both production and lab use.

What are the main applications?

Primary applications include semiconductor front-end and back-end processes, such as Wafer Geometry, Thin Film Metrology, and Advanced Packaging inspection (Bump height, Coplanarity).

Cyber Non-contact Profilometer CT 350T&CT 250T

CT 350T&CT 250T

Cyber Non-contact Profilometer

Non-contact Prof..
Cyber Applicatio..
Optical Barcode ..
Thermo-tracker/S..

SEMI/PCB Measurement - Precision Inspection, Quality Control

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Non-contact Prof..
Cyber Applicatio..
Optical Barcode ..
Thermo-tracker/S..

CT 350T&CT 250T

Cyber Non-contact Profilometer

CT 350T&CT 250T

Precise and fast 2D/3D non-contact dual-head profiling system.
3D graphics of thickness, bending, warpage and roughness.
Simple and easy-to-use user interface.
Profiling area: 350 mm X 350 mm (CT 350T), 200 mm X 200 mm (CT 250T).
Precise analysis and automation software.

【Applicable Range】 Thickness measurement of thick film printing, hybrid circuits, BGA, TAB and FLIP CHIP.

【Application】 Semiconductor industry packaging and testing, optoelectronic industry, PCBs fabrication, SMT industry, hybrid circuits, passive components.

Product Description

Other Product Description

CT 350T&CT 250T

Thickness of a Fuel Cell Component

Wafer Thickness Map

Front- and Backside Metallization of a Solar Cell

Cyber Technologies Vantage