What is Coplanarity measurement?

Coplanarity refers to the vertical distance difference between the lowest and highest points of an electronic component (like BGA solder balls or QFP pins). Ensuring good coplanarity is key to preventing SMT soldering defects (such as open or short circuits).

How does the Cyber Technologies system measure coplanarity?

The system utilizes high-resolution 3D optical sensors to scan the bottom of the component, creating a complete 3D profile model, and automatically calculates the height of each pin or solder ball and the overall coplanarity data through software.

What electronic components is it suitable for?

Widely suitable for BGA (Ball Grid Array), QFP (Quad Flat Package), connectors, sockets, and various Surface Mount Devices (SMD) that require precise pin height control.

Cyber Non-contact Profilometer COPLANARITY MEASUREMENT

COPLANARITY MEASUREMENT

Cyber Non-contact Profilometer

Non-contact Prof..
Cyber Applicatio..
Optical Barcode ..
Thermo-tracker/S..

SEMI/PCB Measurement - Precision Inspection, Quality Control

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Non-contact Prof..
Cyber Applicatio..
Optical Barcode ..
Thermo-tracker/S..

COPLANARITY MEASUREMENT

Cyber Non-contact Profilometer

COPLANARITY MEASUREMENT

The benefits of using a cyberTECHNOLOGIES`s system are non-destructive and fast roughness measurements including automatic defect detection with 3D edge finding.

【Application】 ct-100、vantage-2

Product Description

Other Product Description

COPLANARITY MEASUREMENT

Our optical systems measure even highly reflective materials (i.e. bumps).

COPLANARITY OF A MICRO BGA

Measures true bump shape, even on highly reflective surfaces
Automatic bump recognition using 3D etch detection

SURFACE IMAGE OF A MICRO BGA

Measure max. height, diameter and position of each bump
Regression and seating plane coplanarity

COPLANARITY OF A SMT COMPONENT

Measure height and position of each lead
Regression and Seating Plane Coplanarity