What is the difference between S8 and S3 models?

The S8 is designed for large substrates and multi-panel arrays, featuring a larger working area suitable for mass resistor array trimming.

What substrate sizes can it handle?

The TF-3050 S8 supports an enlarged working table to accommodate various standard ceramic substrate sizes and facilitates integration with automatic loading/unloading systems.

Passive Component Industry Thin Film Laser Trimmer S8

Thin Film Laser Trimmer S8

Passive Component Industry

Passive Componen..
PCB/FPC Industry
Semiconductor In..
Optoelectronics ..

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Thin Film Laser Trimmer S8

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Passive Componen..
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Semiconductor In..
Optoelectronics ..

Thin Film Laser Trimmer S8

Passive Component Industry

Thin Film Laser Trimmer S8

TF-3050 S8

A new generation platform for trim and test of Thin Film chip components.
Ability to trim substrates with resistors of size 0201(inches).
Capability to trim from milli-ohms(mΩ) to Mega-ohms(MΩ).
Advanced vision and motion subsystems provide improved positioning and alignment capability.
Improved pick up arm for efficient pick up and placing of substrates.
Windows 10 operating system with WINLTS (Chinese/English) Trimmer software.
Can be integrated with lasers of 3 different wavelengths(355nm, 532nm, 1064nm).

【Laser Type】 Diode pumped Q-switched (532nm)

【Application】 Thin-film R-SMD Laser Trimmer