What substrates can AS-01005UV process?

It is designed for Ceramic Substrates, specifically for scribing and cutting processes of miniaturized 01005/0201 components.

UV Laser significantly reduces the Heat Affected Zone (HAZ), achieving finer scribing widths and burr-free cutting quality, ideal for fragile ceramic materials.

Passive Component Industry Laser Scriber UV(Thick Film Trimmer)

Laser Scriber UV(Thick Film Trimmer)

Passive Component Industry

Passive Componen..
PCB/FPC Industry
Semiconductor In..
Optoelectronics ..

Laser Equipment - Precision Processing, Innovative Technology

HOME
>
Products
>
LASER Equipment
>
Passive Component Industry
>
Thick Film Trimmer
>
Laser Scriber UV(Thick Film Trimmer)

🔍

Passive Componen..
PCB/FPC Industry
Semiconductor In..
Optoelectronics ..

Laser Scriber UV(Thick Film Trimmer)

Passive Component Industry

Laser Scriber UV(Thick Film Trimmer)

AS-01005

Suitable for 01005 ceramic substrates.
Suitable for 0.08–0.11mm substrates.
Dual CCD vision navigation system.
Fine scribing quality with very few burrs.
Vision system assisted navigation.

【Laser Type】 UV Laser(355nm)

【Application】 Ceramic substrates scribing (for 01005)

Product Description

Other Product Description

01005 scribing <br>(line width of 9–15μm)