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Laser Equipment - Precision Processing, Innovative Technology
Laser Equipment - Precision Processing, Innovative Technology
LED Laser Drill/Scribing
Optoelectronics Industry
LED Laser Drill/Scribing
High-speed processing model, up to 40 holes/sec
- Applicable to all kinds of ceramic material processing.
- High-precision drilling, scribing, abnormal shape cutting can be done at the same time.
- High output up to 40 holes/sec.
- Automatic production that reduces loss from manual loading and saves labor cost.
- Easy loading and reloading with low maintenance cost.
- Model with the most market share.
- First choice for vehicle-to-everything.
- High-precision navigation applicable to substrate post-processing.
- Optional light source for product post-processing with low sputter effect.
- 【Laser Type】 IR Laser
- 【Application】 Sub-mount processing
Product Description
Other Product Description
Ceramic PCB
Target process
1.Scribing process (continuous scribe line)
2.Scribing process (continuous scribe line)
1.Square hole cutting process
2.Square hole cutting process
Round hole process
1.Cutting and scribing surface state
2.Cutting and scribing surface state
Scribing process (dot matrix)
Technical specification
Detailed related technical specifications.
| Items | Specification | |||
|---|---|---|---|---|
| System | Includes: Light source, stage control system, computer, etc. | Dimension | 1200mm(W)X1300mm(L)X1800mm(H)(stacklight not included) | |
| Weight | 1500kg | |||
| Stage | XY-axis | Stage table size | 400mmX300mm | |
| Light source | Laser wavelength | |||
| Light source | Laser wavelength | IR 1064 nm | IR 1064 nm | |
| Power | 500W | 50W | ||