Laser Dry Etching Circuit Direct Forming Machine / Laser Direct Forming Machine LDS

雷科股份有限公司

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All employees pursue excellence
  • Passive Component Industry
    Passive Component Industry
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor Industry
  • Optoelectronics Industry
    Optoelectronics Industry

PCB/FPC Industry

FPC Industry / Laser Dry Etching Circuit Direct Forming Machine / Laser Direct Forming Machine LDS

Laser Dry Etching Circuit Direct Forming Machine / Laser Direct Forming Machine LDS
Laser Dry Etching Circuit Direct Forming Machine / Laser Direct Forming Machine LDS
  • Equipped with femtosecond laser, cold processing technology, no damage to materials.
  • Using femtosecond characteristics for processing, short pulse time, low thermal effect, rapid material ablation, reducing carbonization and thermal diffusion caused by laser on materials.
  • Applicable to various materials PI Film, cover layer, FR4, FPC, PTFE, Ceramic, LTCC.
  • Get the forming result within 10 minutes, high efficiency provides the best choice for testing electrical properties.

Product Description

Other Product Description

2D Barcode marking
2D Barcode marking
2D Barcode marking
2D Barcode marking
2D Barcode marking
2D Barcode marking